Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM
Metadatos
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MDPI
Materia
Equivalent circuit Improving scanning TEM waveguide unit-cell 3D all-metal
Fecha
2022-09-09Referencia bibliográfica
Bermúdez-Martín, D... [et al.]. Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM. Electronics 2022, 11, 2848. [https://doi.org/10.3390/electronics11182848]
Patrocinador
European Union through the European Regional Development Fund (ERDF); french region of Brittany; Conseil Departemental 35 through the CPER Project SOPHIE/STIC Ondes; Ministry of Higher Education & Scientific Research (MHESR); Thales Group; Region BretagneResumen
All-metal 3D printing technologies are allowing the conception of new structures for different applications. This publication explores the potential of employing for the first time an all-metal 3D unit-cell topology to perform wide-angle impedance matching layers. A new equivalent circuit is derived for the oblique incidence, providing a good estimation of the cell response for the scanning range (theta = [0 degrees, 55 degrees]) in the main scanning planes for a linearly polarized radiated field. This analytical model is later used to develop a wide-angle impedance matching design methodology for a generic antenna. This methodology is tested in practice to match a phased array made of metallic horns at 18 GHz. An improvement of 5 dB is obtained in the simulations for angles theta > 35 degrees for the H -plane.