Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM Bermúdez Martín, Diego Molero Jiménez, Carlos Equivalent circuit Improving scanning TEM waveguide unit-cell 3D all-metal All-metal 3D printing technologies are allowing the conception of new structures for different applications. This publication explores the potential of employing for the first time an all-metal 3D unit-cell topology to perform wide-angle impedance matching layers. A new equivalent circuit is derived for the oblique incidence, providing a good estimation of the cell response for the scanning range (theta = [0 degrees, 55 degrees]) in the main scanning planes for a linearly polarized radiated field. This analytical model is later used to develop a wide-angle impedance matching design methodology for a generic antenna. This methodology is tested in practice to match a phased array made of metallic horns at 18 GHz. An improvement of 5 dB is obtained in the simulations for angles theta > 35 degrees for the H -plane. 2022-10-14T11:24:40Z 2022-10-14T11:24:40Z 2022-09-09 journal article Bermúdez-Martín, D... [et al.]. Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM. Electronics 2022, 11, 2848. [https://doi.org/10.3390/electronics11182848] https://hdl.handle.net/10481/77318 10.3390/electronics11182848 eng http://creativecommons.org/licenses/by/4.0/ open access Atribución 4.0 Internacional MDPI