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dc.contributor.authorBermúdez Martín, Diego
dc.contributor.authorMolero Jiménez, Carlos 
dc.date.accessioned2022-10-14T11:24:40Z
dc.date.available2022-10-14T11:24:40Z
dc.date.issued2022-09-09
dc.identifier.citationBermúdez-Martín, D... [et al.]. Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM. Electronics 2022, 11, 2848. [https://doi.org/10.3390/electronics11182848]es_ES
dc.identifier.urihttps://hdl.handle.net/10481/77318
dc.description.abstractAll-metal 3D printing technologies are allowing the conception of new structures for different applications. This publication explores the potential of employing for the first time an all-metal 3D unit-cell topology to perform wide-angle impedance matching layers. A new equivalent circuit is derived for the oblique incidence, providing a good estimation of the cell response for the scanning range (theta = [0 degrees, 55 degrees]) in the main scanning planes for a linearly polarized radiated field. This analytical model is later used to develop a wide-angle impedance matching design methodology for a generic antenna. This methodology is tested in practice to match a phased array made of metallic horns at 18 GHz. An improvement of 5 dB is obtained in the simulations for angles theta > 35 degrees for the H -plane.es_ES
dc.description.sponsorshipEuropean Union through the European Regional Development Fund (ERDF)es_ES
dc.description.sponsorshipfrench region of Brittanyes_ES
dc.description.sponsorshipConseil Departemental 35 through the CPER Project SOPHIE/STIC Ondeses_ES
dc.description.sponsorshipMinistry of Higher Education & Scientific Research (MHESR)es_ES
dc.description.sponsorshipThales Groupes_ES
dc.description.sponsorshipRegion Bretagnees_ES
dc.language.isoenges_ES
dc.publisherMDPIes_ES
dc.rightsAtribución 4.0 Internacional*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/*
dc.subjectEquivalent circuites_ES
dc.subjectImproving scanninges_ES
dc.subjectTEM waveguide unit-celles_ES
dc.subject3D all-metales_ES
dc.titleMethodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIMes_ES
dc.typejournal articlees_ES
dc.rights.accessRightsopen accesses_ES
dc.identifier.doi10.3390/electronics11182848
dc.type.hasVersionVoRes_ES


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