Geometrical variability impact on the gate tunneling leakage mechanisms in FinFETs
Metadatos
Afficher la notice complèteAuteur
Medina Bailón, Cristina; Padilla De la Torre, José Luis; Donetti, Luca; Navarro Moral, Carlos; Sampedro Matarín, Carlos; Gámiz Pérez, Francisco JesúsEditorial
Elsevier Ltd.
Materia
Geometrical variability Gate leakage mechanism Direct oxide tunneling
Date
2025-12Referencia bibliográfica
Medina-Bailon, C., Padilla, J. L., Donetti, L., Navarro, C., Sampedro, C., & Gamiz, F. (2025). Geometrical variability impact on the gate tunneling leakage mechanisms in FinFETs. Solid-State Electronics, 230(109212), 109212. https://doi.org/10.1016/j.sse.2025.109212
Patrocinador
MICIU/AEI (projects PID2020-119668GB-I00 and PLEC2022-00938, +QCHIP TSI-069100-2023-0003, HORIZON-JU-Chips-2023-RIA-CPL-2, IJC2019-040003-I); Universidad de Granada / CBUA (Open access)Résumé
Given the critical role that quantum tunneling effects play in the behavior of nanoelectronic devices, it is
essential to investigate the influence and restraints of these phenomena on the overall transistor performance.
In this work, a previously developed gate leakage model, incorporated into an in-house 2D Multi-Subband
Ensemble Monte Carlo simulation framework, is employed to analyze the leakage current flowing across the
gate insulator. The primary objective is to evaluate how variations in key geometrical parameters (specifically,
gate oxide and semiconductor thicknesses dimensions) affect the magnitude and bias dependence of tunnelinginduced leakage. Simulations are performed on a representative FinFET structure, and the results reveal that
tunneling effects become increasingly pronounced at low gate voltages in devices with thinner oxides and
thicker semiconductor thickness. These findings underscore the relevance of incorporating quantum tunneling
mechanisms in predictive modeling of advanced transistor architectures.





