Template-Free Ultrafast Directed SelfAssembly Using Biaxial Toggled Magnetic Fields
Metadatos
Mostrar el registro completo del ítemEditorial
American Chemical Society
Materia
Magnetorheological fluids Magnetic colloids Continuous magnetic fields Pulsed magnetic fields Toggled magnetic fields Directed self-assembly
Fecha
2025-07-30Referencia bibliográfica
Camacho, G., & de Vicente, J. (2025). Template-free ultrafast directed self-assembly using biaxial toggled magnetic fields. ACS Nano, 19(31), 28873–28887. https://doi.org/10.1021/acsnano.5c09450
Patrocinador
MCIN/AEI/10.13039/501100011033 - EU/ PRTR (PID2022-138990NB-I00; TED2021.129384B.C22; FPU20/04357)Resumen
Speeding up the directed self-assembly of functional
nanomaterials is a rapidly advancing area of research. Traditional
self-assembly methods can be slow and limited by kinetic barriers.
In this study, we demonstrate that the process can be dramatically
accelerated for magnetic colloids when biaxial toggled magnetic
fields (BTFs) are used. In this field configuration, a transversal
pulsed magnetic field is superimposed perpendicular to the primary
toggled magnetic field, facilitating faster phase separation in a
model magnetic colloid. This approach offers enhanced control over
aggregation dynamics by adjusting the field’s frequency and
intensity and does not require any physical templates. Beyond
structure control, the aggregation kinetics can also be precisely tuned. Within the context of magnetic materials, this method
enables the formation of diverse and tunable structures such as chains, columns, depercolated aggregates, and percolating
bands. BTFs further promote the formation of highly crystalline domains, enhancing the properties of the resulting selfassembled materials. While this technique is specifically tailored for magnetic systems, its versatility makes it relevant for the
design and fabrication of functional nanomaterials. The ability to tune aggregation kinetics and achieve a range of structures
may be beneficial for applications in photonics, electronics, and biomedicine.
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